The "BlueMod+S" Bluetooth Smart Module from Stollmann is an ideal solution for connections to smart phones and for cable replacement applications for which low energy consumption is important. It is extremely small (17x10x2.6 mm), has a radio range of approx. 50 m (line of sight) and an energy consumption of less than 0.5 µA in the "deep-sleep" mode.
BlueMod+S supports the Terminal I/O profile, which - comparable to SPP - offers a simple point-to-point connection. The module is equipped with an AT Command interface.
Both the hardware and the software interface of the BlueMod+S is compatible to the "BlueMod+SR" dual-mode module from Stollmann (depending on the firmware used). Both modules are therefore interchangeable with each other without making changes to the hardware or the software environment.
"The new BlueMod+S is the logical further development of our Bluetooth Low Energy product range. It combines high quality with an extremely small size and a broad range of functions," said Florian Herrmann, Director of Wireless Products at Stollmann.
Sample modules can be ordered on our website at www.stollmann.de.
Stollmann will present the module to its customers at the 2014 embedded world trade fair (Hall 2, Stand 559) in Nuremberg, Germany.
BlueMod+S supports the Terminal I/O profile, which - comparable to SPP - offers a simple point-to-point connection. The module is equipped with an AT Command interface.
Both the hardware and the software interface of the BlueMod+S is compatible to the "BlueMod+SR" dual-mode module from Stollmann (depending on the firmware used). Both modules are therefore interchangeable with each other without making changes to the hardware or the software environment.
"The new BlueMod+S is the logical further development of our Bluetooth Low Energy product range. It combines high quality with an extremely small size and a broad range of functions," said Florian Herrmann, Director of Wireless Products at Stollmann.
Sample modules can be ordered on our website at www.stollmann.de.
Stollmann will present the module to its customers at the 2014 embedded world trade fair (Hall 2, Stand 559) in Nuremberg, Germany.
