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Continuous Innovation in Packaging and Manufacturing Processes: How to ensure best quality and process control at competitive cost?
Multitest offers innovative approaches for test strategies of 3D ICs and Sensors - Meet Multitest at ECTC, May 28-30, Las Vegas
Experts for 3D integration and sensor test will be available to discuss "More than Moore" and its implications for semiconductor and MEMS production. Advanced packaging and manufacturing processes target highest functionalities, speed and electrical performance of ICs and sensors at best cost. 3D integration - both with TSV and PoP - additionally supports the trend to minimum package sizes. For manufacturing, this implies new assembly processes and supply chain interdependencies. New risks and uncertainties and may cause significant reliability issues and financial troubles. On the MEMS side, integrated packages with multiple sensor types require smart test set-ups to ensure cost-efficient multi-DOF test. Which test equipment is the most appropriate one?
How to deal with these uncertainties? Which processes and equipment types have to be cautiously reviewed? Is the established concept of Known Good Die really sufficient? Will custom-tailored sensor test equipment allow for competitive cost of test?
Multitest discussed new production and test strategies with various leading IC and sensor manufacturers. Based on more than 10 years in MEMS test, Multitest can offer standardized test equipment for up to 9 DOFs in on insertion. Leveraging the expertise of three decades in IC test, Multitest introduced new, unique equipment for in-process test of 3D packages: Multitest InStrip3D. The Instrip3D was qualified for production in summer 2012 for the first time and won Circuits Assembly magazine's NPI Award in the category of Test & Inspection - Functional Test earlier this year.
James Quinn, VP Sales and Marketing, commented: "For us, this award also recognizes Multitest to be the first equipment supplier to deliver a full turnkey hardware set up for in-process test in 3D assembly. Our unique product portfolio enables us to partner with our customers to develop comprehensive solutions for this emerging packaging technology that we see as a major strategic initiative in the semiconductor industry. With the initial challenges in wafer processes being addressed, the industry now faces the need to develop advanced test strategies. We are convinced that smart approaches for optimal test insertion points will make test a key differentiator."
Complimentary visitor entrance passes are available at www.multitest.com/ECTC.
The premier international packaging, components, and microelectronics systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer our attendees an outstanding array of packaging technology information. This year's conference will have about 40 technical sessions (oral presentations, interactive presentations, and student posters), 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors. The 63rd ECTC will be held at the Cosmopolitan of Las Vegas, Las Vegas, Nevada, USA from May 28 - May 31, 2013.
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.
The Professional Development Courses offer state-of-the-art technology reviews and updates in a condensed half-day format. Topics cover a wide range of technologies.
The Panel Discussion, Plenary Session, and CPMT Seminar in the evenings offer a format that allows for ample exchange and dialogue between the presenters and audience. They provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.
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