Fast and automated: quantitative VRM stability on your oscilloscope
In this webinar, Benjamin Dannen, CEO of Signal Edge Solutions, will demonstrate Picotest’s Scope Embedded Power Integrity Analysis (SEPIA), a software solution that runs directly on an oscilloscope. Using data from a time-domain step-load measurement, SEPIA analyzes the power supply’s response and generates a high-fidelity RLC equivalent SPICE model of its output impedance.
Participants will learn how SEPIA can be used to:
• Quantitatively assess stability, including phase margin and quality factor (Q), directly from measured time-domain data
• Determine natural and forced resonance frequencies and derive the corresponding frequency-domain output impedance
• Identify key system parameters, including characteristic impedance, total output capacitance and excess inductance
• Export the extracted model to a SPICE simulator for system-level co-simulation
• Optimize output capacitance to meet a defined target impedance or determine the adjustments required to achieve a stable design
By turning step-load response data into actionable design insights, SEPIA extends the oscilloscope from a measurement instrument into an integrated tool for power integrity analysis, optimization and simulation.
Speakers:
Dr. Luca Gragnaniello, Product Manager Oscilloscopes, Rohde & Schwarz
Dr. Luca Gragnaniello works as a Product Manager for Oscilloscopes, with a focus on power integrity and RF applications. He joined Rohde & Schwarz in 2022, after several years of experience in Product Management and Development for Scientific Instrumentations, carrying also a deep academic background, thanks to seven years as a scientific researcher in renowned European universities. Luca holds a Diploma in Physics and a PhD in Nanoscience and Nanotechnology.
Benjamin Dannan, Founder & Chief Technologist, Signal Edge Solutions
Benjamin Dannan is the Founder and Chief Technologist at Signal Edge Solutions. Benjamin Dannan is an experienced signal and power integrity (SI/PI) design consultant developing advanced packaging solutions for high-performance ASICs, chiplets, and complex FPGA designs. He has expert-level proficiency with multiple test and measurement solutions, including oscilloscopes, vector network analyzers (VNA), Time Domain Reflectometers (TDRs), function generators, and EMC lab testing equipment.
He is a senior member of IEEE with a multi-faceted background that includes a wide range of professional engineering and military experiences. His engineering experience includes designing, developing, and launching production products, including ASICs, radars, fully autonomous robotic platforms, pan-tilt-zoom (PTZ) camera video systems, and ground combat vehicles.
He is a specialist in signal and power integrity concepts, high-speed circuits, and multi-layered PCB design, as well as has multiple years of experience with EMC product development and certifications to support global product launches. Additionally, he has extensive experience with Chip-Package-PCB-VRM power delivery network (PDN) principles.
Benjamin holds a certification in cybersecurity, has a BSEE from Purdue University, a Master of Engineering in Electrical Engineering from The Pennsylvania State University, and graduated from the USAF Undergraduate Combat Systems Officer training school with an aeronautical rating. Benjamin is a trained Electronic Warfare Officer in the USAF with deployments on the EC-130J Commando Solo in Afghanistan and Iraq, totaling 47 combat missions, and a trained USAF Cyber Operations Officer. In addition, he was awarded the DesignCon 2025 Engineer of the Year, has co-authored multiple peer-reviewed journal publications, and has twice received the prestigious DesignCon Best Paper award, given to authors who are leading practitioners in semiconductor and electronic design.