Pressemitteilung BoxID: 769946 (Polytec PT GmbH Polymere Technologien)
- Polytec PT GmbH Polymere Technologien
- Polytec-Platz 1-7
- 76337 Waldbronn
- Andreas Bauer
- +49 (7243) 604-4050
New Adhesives for Thermal Challenges in Microelectronics Assemby
Polytec TC 433 and TC 432
(PresseBox) (Waldbronn, 09.12.15) Thermally conductive mounting of power devices, e.g. LEDs, on respective heat sinks can be substantially enhanced by using Polytec’s TC 433 boron nitride filled adhesive featuring 2 W/mK thermal conductivity and a glass transition around 110 °C after thermal curing, and withstanding up to 220 °C continuous operation temperature. TC 432 is a modification curing at room temperature with a pot life of ca. 15 min, about 1.8 W/mK thermal conductivity and ca. 75 – 80 °C glass transition temperature.
Polytec PT GmbH Polymere Technologien
Polytec PT GmbH develops, manufactures and distributes special adhesives for applications in electronics, electrical engineering and automotive electronics as well as the solar industry and the manufacture of smart cards. In addition to an extensive portfolio of electrically and thermally conductive adhesives, transparent and UV-hardening products, Polytec PT develops tailored formulations for the most demanding of adhesive applications.