NXP Semiconductors N.V. (NASDAQ: NXPI) today introduced a new portfolio of LDMOS power transistors designed for small cell wireless base stations. With dedicated solutions for both picocell and microcell architectures - which average 1 to 2 W, and 8 to 12 W, respectively - the RF power transistors span frequency ranges from 700 MHz to 2.7 GHz and include the world's first asymmetric MMICs, as well as low-cost, low-power plastic devices. Delivering an optimal balance of energy efficiency and integration, NXP's extensive high-performance RF portfolio provides unprecedented flexibility in designing highly scalable, cost-optimized systems. NXP is now showcasing its new small cell portfolio at European Microwave Week in Amsterdam (booth 515), and an explanation of NXP's modular approach to MMICs is available here: http://youtu.be/LbJzeMZDhkI
"Small cells are emerging as a cost-effective approach to increase wireless network capacity and quality of service, when used as a complement to macro base stations. By offering a broad portfolio of energy-efficient LDMOS power transistors dedicated to picocells, microcells and active antenna systems, we're providing the flexibility needed to build highly versatile, scalable small-cell solutions," said Christophe Cugge, director of marketing, base station power amplifiers, NXP Semiconductors.
NXP solutions for microcells include:
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.
"Small cells are emerging as a cost-effective approach to increase wireless network capacity and quality of service, when used as a complement to macro base stations. By offering a broad portfolio of energy-efficient LDMOS power transistors dedicated to picocells, microcells and active antenna systems, we're providing the flexibility needed to build highly versatile, scalable small-cell solutions," said Christophe Cugge, director of marketing, base station power amplifiers, NXP Semiconductors.
NXP solutions for microcells include:
- Asymmetric and symmetric MMICs for dual-stage microcells. NXP has introduced a new range of monolithic microwave integrated circuits, including the industry's first asymmetric MMICs, which provide more power efficiency at back-off and offer increased flexibility, particularly in Doherty configurations in microcells and antenna arrays. The first MMIC based on NXP's Gen7 LDMOS technology, the BLM7G22S-60PB(G), is fully released, with qualification samples of 7 new product types now available. All 7 MMICs are dual path with two separate amplifiers, each with 30-dB gain and a certain power rating of P1 dB. Ideal for dual-stage micro base stations where high integration is a priority, NXP's family of symmetric and asymmetric MMICs offer a modular approach, allowing different power levels on each path, as well as better isolation between the two paths for better Doherty performance and stability.
- LDMOS power transistors for single-stage, high-performance microcells. For the most performance-sensitive microcells, NXP has introduced a range of single-stage dual-path devices in different bands, including the BLF6G22LS-40P and the BLF6G27LS-40P, which are currently in volume production. Additional products, including the BLP7G10S-45P, the BLP7G22S-60P and the BLF8G27LS-50A are currently in development.
- Low-power LDMOS transistors. NXP now offers the plastic 10-W BLP7G22-10, providing 17 dB gain at 2.0 GHz, and the 7.5-W BLP7G27-07, providing 15.3 dB gain at 2.6 GHz, for final-stage picocell applications in a variety of configurations from Class A to Doherty. NXP's low-power plastic LDMOS transistors offer high performance at 12 volts, with a peak power of 4 watts - for example, in a high-efficiency 1 watt picocell using two devices in a Doherty configuration. Further, as pre-drivers or drivers in both micro and macro base stations, they can serve as low-cost alternatives to the ceramic BLF6G21-10G and BLF6G27-10G, which are in mass production. NXP is also developing two MMICs for this power class.
- VIDEO: Introducing NXP MMICs: A modular approach: http://youtu.be/LbJzeMZDhkI
- NXP RF power transistors for base stations: http://www.nxp.com/...
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.
