ADLINK Technology Revolutionizes Rugged Small Form Factor (SFF) Computing with the CoreModule® 730 SBC
First to market from a leading multi-national supplier with the ground-breaking SUMIT(TM) interface in 90x96 mm ISM(TM) form factor, CoreModule® 730 ushers in a new 'Atomic' Era of Rugged Computing
With PCI Express, Gigabit Ethernet, USB 2.0 ports, and a CompactFlash® socket, the CoreModule® 730 features the lowest power Intel chipset available, the US15W, to complement the Intel® Atom(TM) processor for a total power consumption of only 5 watts. Conductive cooling solutions are also easy to implement for small sealed boxes with no internal air flow. The release of the CoreModule® 730 means that system OEMs in military, avionics, transportation, data logging, portable computing and other rugged markets can add a state-of-the-art Intel® Architecture controller to their systems without a custom carrier board design.
"While many board manufacturers require their system OEM customers to design custom carriers or use two-board solutions in order to take advantage of their Atom-based computer-on-module (COM) products, ADLINK offers CoreModule® 730 as a true single-board solution, ready to run with simple cables," said Colin McCracken, product director for ADLINK's embedded computer division. "By departing from space-inefficient pin-in-socket expansion with parallel buses, CoreModule® 730 will bring stackable SBCs into new application areas. Even after the merger, ADLINK continues to build upon Ampro's reputation and tradition of pioneering modular small form factor technologies for high-reliability and long lifecycle embedded markets."
About the CoreModule® 730
The CoreModule® 730 is the first SUMIT-ISM(TM) product on the market. SUMIT(TM) is the new standard expansion interface from the Small Form Factor Special Interest Group (SFF-SIG), www.sff-sig.org. ISM(TM) stands for Industry Standard Module, and is a 90x96mm form factor that specifies a board outline and mounting holes and is completely flexible in terms of expansion interfaces. ISM(TM) is also defined by the SFF-SIG. The CoreModule® 730 offers a choice of 1.1 GHz and 1.6 GHz Atom(TM) processors, US15W chipset, DDR2 533 SODIMM RAM up to 2 GB, Gigabit Ethernet, four USB 2.0 ports, IDE interface, CompactFlash socket, 8 general-purpose I/O pins (GPIOs), and integrated graphics engine with H.264 decode acceleration, analog VGA output and 18-bit / 24-bit LVDS interface for LCD displays.
ADLINK Technology GmbH
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries.
ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA®, CompactPCI®, and COM Express(TM) modules for industrial computing. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, and TL9000 certified, is an Associate Member of the Intel® Embedded and Communications Alliance, an Executive Member of PICMG®, and a Sponsor Member of the PXI Systems Alliance. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).
For more information, please visit: http://www.adlinktech.com.
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