The International Engineering Consortium (IEC) today announced that the edacentrum e.V. will serve as an Associate Sponsor of its newest event called Euro DesignCon 2004. Based on IEC's unique and time-tested DesignCon program in the U.S., Euro DesignCon will consist of a conference and technology exhibition to showcase practical design solutions for engineers in Europe.
Developed specifically for semiconductor and electronic design engineers, Euro DesignCon presentations will address current issues that are most significant to the European design community through a comprehensive educational program of keynote and plenary panels, technical papers, and tutorials. A highlight of the event will be the hands-on exhibition featuring more than 30 industry-leading companies.
"The goal of Euro DesignCon is to help engineers keep pace with advances in microelectronics being made at a staggering pace," explained John Janowiak, Senior Director of the IEC. "This is why we are very pleased that the edacentrum has joined us as an Associate Sponsor."
A core belief of the edacentrum is that Electronic Desgn Automation is the key technology of microelectronics, which will be the driver of the information and communication society. "Projections tell us that in 2010, it will be possible to integrate 5 billion transistors on one single chip," stated Erich Barke, Chairman of the edacentrum. "As a result of shorter production cycles, design teams will have to design them within a few months. If we want to reach this target, we must at least double our design productivity every year. There has never been an industrial sector demanding such numbers and efforts," he concluded.
Euro DesignCon 2004 will take place 11-14, October 2004 at the ArabellaSheraton Grand Hotel in Munich, Germany. More information about Euro DesignCon can be found at www.designcon.com/euro.
About DesignCon Events (http://www.designcon.com) DesignCon, DesignCon East, and Euro DesignCon conference programs provide education and updates on the latest technology advances affecting design engineers working at the chip, board, and system levels. The DesignCon technology exhibition delivers practical approaches, techniques, and procedures directly on the show floor, where leading-edge displays from key organizations offer proven solutions for immediate application.
About the IEC (http://www.iec.org) The International Engineering Consortium (IEC) is a nonprofit organization dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students. In conjunction with industry-leading companies, the IEC has developed an extensive free on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age. More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association.
Developed specifically for semiconductor and electronic design engineers, Euro DesignCon presentations will address current issues that are most significant to the European design community through a comprehensive educational program of keynote and plenary panels, technical papers, and tutorials. A highlight of the event will be the hands-on exhibition featuring more than 30 industry-leading companies.
"The goal of Euro DesignCon is to help engineers keep pace with advances in microelectronics being made at a staggering pace," explained John Janowiak, Senior Director of the IEC. "This is why we are very pleased that the edacentrum has joined us as an Associate Sponsor."
A core belief of the edacentrum is that Electronic Desgn Automation is the key technology of microelectronics, which will be the driver of the information and communication society. "Projections tell us that in 2010, it will be possible to integrate 5 billion transistors on one single chip," stated Erich Barke, Chairman of the edacentrum. "As a result of shorter production cycles, design teams will have to design them within a few months. If we want to reach this target, we must at least double our design productivity every year. There has never been an industrial sector demanding such numbers and efforts," he concluded.
Euro DesignCon 2004 will take place 11-14, October 2004 at the ArabellaSheraton Grand Hotel in Munich, Germany. More information about Euro DesignCon can be found at www.designcon.com/euro.
About DesignCon Events (http://www.designcon.com) DesignCon, DesignCon East, and Euro DesignCon conference programs provide education and updates on the latest technology advances affecting design engineers working at the chip, board, and system levels. The DesignCon technology exhibition delivers practical approaches, techniques, and procedures directly on the show floor, where leading-edge displays from key organizations offer proven solutions for immediate application.
About the IEC (http://www.iec.org) The International Engineering Consortium (IEC) is a nonprofit organization dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students. In conjunction with industry-leading companies, the IEC has developed an extensive free on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age. More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association.
