BRESSNER Technology GmbH is expanding its portfolio of industrial flash storage solutions with the new ATP e.MMC Smaller Footprint series. With a form factor of just 6.7 mm, the series sets new standards in miniaturization and enables high-performance storage solutions for space-constrained applications such as smart wearables, edge devices, and compact embedded systems.
As a system integrator and value-added distributor, BRESSNER Technology provides its customers with access to this innovative storage technology and supports integration into customized system architectures.
Ultra-compact design for maximum design flexibility
The new e.MMC modules of the E700Pc and E600Vc series are based on a 125-ball FBGA package and are up to 67 percent smaller than conventional e.MMC solutions. With a height of only 0.65 mm, they are ideally suited for ultra-slim devices such as smart glasses or other compact embedded applications where every millimeter matters.
Despite the significant miniaturization, performance remains at a high level: the modules support the JEDEC e.MMC 5.1 standard (HS400) and achieve data transfer rates of up to 400 MB/s.
High energy efficiency for battery-powered systems
A key feature of the new series is its optimized firmware, enabling fast transitions between active and idle modes. This allows for power savings of up to 70 percent, a crucial advantage for mobile and battery-powered applications.
“With the new e.MMC Smaller Footprint series, we offer our customers a state-of-the-art storage solution specifically designed for the requirements of compact and energy-efficient systems. Especially in the field of wearables and edge AI, this opens up new possibilities in product design,” explains Maximilian Kopp, Account Manager at BRESSNER Technology.
Flexible storage options and high endurance
The series offers different configurations to meet various requirements:
Designed for industrial environments
The ATP e.MMC Smaller Footprint series is engineered for operation in demanding environments. It supports an extended temperature range of -25°C to +85°C and, thanks to its soldered design, offers high resistance to vibration, making it ideal for industrial, mobile, and outdoor applications.
As a system integrator and value-added distributor, BRESSNER Technology provides its customers with access to this innovative storage technology and supports integration into customized system architectures.
Ultra-compact design for maximum design flexibility
The new e.MMC modules of the E700Pc and E600Vc series are based on a 125-ball FBGA package and are up to 67 percent smaller than conventional e.MMC solutions. With a height of only 0.65 mm, they are ideally suited for ultra-slim devices such as smart glasses or other compact embedded applications where every millimeter matters.
Despite the significant miniaturization, performance remains at a high level: the modules support the JEDEC e.MMC 5.1 standard (HS400) and achieve data transfer rates of up to 400 MB/s.
High energy efficiency for battery-powered systems
A key feature of the new series is its optimized firmware, enabling fast transitions between active and idle modes. This allows for power savings of up to 70 percent, a crucial advantage for mobile and battery-powered applications.
“With the new e.MMC Smaller Footprint series, we offer our customers a state-of-the-art storage solution specifically designed for the requirements of compact and energy-efficient systems. Especially in the field of wearables and edge AI, this opens up new possibilities in product design,” explains Maximilian Kopp, Account Manager at BRESSNER Technology.
Flexible storage options and high endurance
The series offers different configurations to meet various requirements:
- E600Vc (3D TLC) with 64 GB for standard applications
- E700Pc (pSLC mode) with 20 GB and an exceptionally high endurance of up to 680 TBW
Designed for industrial environments
The ATP e.MMC Smaller Footprint series is engineered for operation in demanding environments. It supports an extended temperature range of -25°C to +85°C and, thanks to its soldered design, offers high resistance to vibration, making it ideal for industrial, mobile, and outdoor applications.
