From compact to ultra-compact: CSP Mosfet WM4C62160A

WAYON is introducing a new ultra-compact 20V/17mOhm Dual-N-Channel Trench CSP MOS device with highest miniturization rate with a PCB area of only 1.5 mm² for highest integration levels. This part is well suited for application requiring best electrical and thermal performance by smallest chip area. A CSP based solution (Chip Size Package) is able to achieve better efficiency, better thermal performance and higher reliability than common parts using copper lead frames. The high density structure of the device has also a big impact on the EMI performance: Because of the low parasitic inductance of the device there is the tendency bza csly tcrdelq ly kpl nhonuiyrzja.

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