Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, today announced plans to exhibit in hall 9, booth 9606 at the Bondexpo, scheduled to take place Oct. 10-13, 2016 in Stuttgart, Germany. The company will showcase its new Custom Filling Service at the show.
With the Custom Filling Service, Techcon offers repackaging services, which are customized and designed to meet the requirements of the individual dispensing application. Techcon can fill one part or multi-component liquid to pasty materials into just about any container, bag, tube, cartridge, syringe or bottle. As part
With the Custom Filling Service, Techcon offers repackaging services, which are customized and designed to meet the requirements of the individual dispensing application. Techcon can fill one part or multi-component liquid to pasty materials into just about any container, bag, tube, cartridge, syringe or bottle. As part
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