Surface mount vs through-hole PCB assembly.
Complete, encapsulated DC/DC regulator circuit in one BGA package vs high component-count, unverified discrete solution.
100% tested point-of-load regulator solutions vs requiring verification and supervision of discrete circuit point-of-load regulator solutions.
Simpler cleaning under the µModule BGA package due to higher standoff compared to flat LGA ij OPW nghzfgoi.
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