Laird Technologies Releases New Tflex(TM) SF600 DF Silicone-Free Thermal Gap Filler

Gap Filler Specifically Designed for Silicone-Sensitive Applications

(PresseBox) ( St. Louis, Missouri, USA, )
Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new Tflex(TM) SF600 DF silicone-free thermal gap filler.

The Tflex(TM) SF600 DF is the most recent addition to Laird Technologies' Tflex(TM) thermal gap filler line. The pad offers a compliant, silicone-free elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0 W/mK.

Available in thicknesses from 0.010 inch (0.25 mm) through 0.060 inch (1.5 mm) in 0.010 inch increments, this soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts. It also includes differential tack on one side and is dry to the touch on the other side, making for easy assembly.

The Tflex(TM) SF600 DF passes "cleanliness" testing requirements and is rated for International Disk Drive Equipment and Manufacturing Association (IDEMA) M11-99, M7-98, M12-99, and M13-99 standards. The gap filler pad is RoHS compliant and is certified to UL 94V0 flammability rating.

"The Tflex(TM) SF600 DF is a high performance, silicone-free thermal gap filler specifically designed for silicone-sensitive applications such as fiber optics, automotive modules, plasma display panels, and hard disk drives (HDDs)," said Jane Bell, Laird Technologies Thermal Interface Materials Product Manager.

As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets. For more information, please logon to
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