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FormFactor Doubles the DRAM Test Capacity of Test Equipment With New Wafer Probe Card Capability
DC-Boost(TM) Test Technology Brings DRAM Industry Closer to One-Touchdown Wafer Testing and Enables Significant Reductions in Total Test Time and Cost of Test
"At Tera Probe, our mission is to provide total testing solutions for our customers that boast greater efficiency, lower costs and ensure higher levels of reliability in order to help them meet their production goals," stated Masahide Ozawa, chief technology officer at Tera Probe, Inc. "FormFactor's DC-Boost capability supports that mission by allowing us to utilize the latest in advanced wafer test technology to enable more efficient, reliable testing of our customers' product wafers."
As DRAM manufacturers move to tighter design configurations, the number of die per wafer continues to rise, in some cases approaching 1500 die or more. At the same time, test managers are driving to maximize the productivity of their test cells. "Reducing the number of touchdowns in wafer testing is the primary driver for reducing test costs," stated Stefan Zschiegner, senior vice president of the DRAM product business unit at FormFactor. "Our DC-Boost test technology brings a new degree of intelligence to our wafer probe cards through the integration of application specific ICs - enabling FormFactor to take wafer test parallelism to the next level. With this technology we can help our customers optimize their existing equipment investment today and provide a clear roadmap for further parallelism improvements on new device designs and tester platforms."
In addition to increasing the device under test, or DUT, capacity of test equipment, DC-Boost minimizes drops in voltage that could lead to over-testing or under-testing of devices. The new technology also provides the ability to test devices in isolation to obtain precise voltage measurements. As a result, customers can achieve a more reliable test result, thereby improving yields.
FormFactor's DC-Boost solution is now being offered on the company's PH150XP and Harmony XP(TM) probe cards for DRAM wafer testing.
Statements in this press release that are not strictly historical in nature are forward-looking statements within the meaning of the federal securities laws, including results the company's customers' might realize when using the company's products, demand for the company's products and future growth. These forward-looking statements are based on current information and expectations that are inherently subject to change and involve a number of risks and uncertainties. Actual events or results might differ materially from those in any forward-looking statement due to various factors, including, but not limited to: the company's ability to enable more efficient use of tester channels on automated test equipment to double the number of devices that can be tested simultaneously, to enable IC manufacturers and test service providers to significantly increase test cell throughput, increase probe test capacity, extend the life of existing test equipment and reduce their overall cost of test, to optimize existing equipment and provide for future roadmaps, to minimize over-testing or under-testing of devices; and the ability of the company's customers to achieve more reliable test results and improve yields. Additional information concerning factors that could cause actual events or results to differ materially from those in any forward-looking statement is contained in the company's Form 10-K for the fiscal year ended December 29, 2007 and the company's Form 10-Q for the fiscal quarter ended June 28, 2008, filed with the Securities and Exchange Commission ("SEC"), and subsequent SEC filings. Copies of the company's SEC filings are available at http://investors.formfactor.com/edgar.cfm. The company assumes no obligation to update the information in this press release, to revise any forward-looking statements or to update the reasons actual results could differ materially from those anticipated in forward-looking statements.
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