Focus on biopolymers: Shanghai site's capacity to be expanded

(PresseBox) ( Essen, )
To meet the constantly growing demand for biopolyamides, Evonik Industries has begun to undertake extensive measures to increase production capacities for the bio-based VESTAMID® Terra polymers at the beginning of this year. As essential component of this plan, an additional compounding facility will become operative in the third quarter of 2012. The new facility will safeguard long-term supplies for specialty compounds, both to existing markets and for many new fields of application. Measures for capacity expansion in the area of polymerization are also in the works. The commissioning is scheduled for the second half of 2013.

Demand for renewably sourced materials has risen substantially in recent years, because, for one, many customers wish to conserve resources sustainably. Evonik's VESTAMID® Terra Product Line offers a broad range of renewably sourced high-performance polyamides whose properties are comparable with strictly oil-based polyamides. VESTAMID® Terra is used in innovative, high-quality products for the electronics, sports, hygiene and cosmetics, and automotive industries. Its CO2 footprint is impressively small: Viewed across its entire lifecycle, VESTAMID® Terra's footprint is more favorable than that attributable to ordinary polyamides made from fossil-based resources. VESTAMID® Terra products therefore make a valuable contribution to reducing the greenhouse effect. A broad spectrum of eco-certification-including among others USDA, DIN, and Certco―has amply confirmed this.

Disclaimer

In so far as forecasts or expectations are expressed in this press release or where our statements concern the future, these forecasts, expectations or statements may involve known or unknown risks and uncertainties. Actual results or developments may vary, depending on changes in the operating environment. Neither Evonik Industries AG nor its group companies assume an obligation to update the forecasts, expectations or statements contained in this release.
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