Assembly in 3D
Miniaturization in electronics has been an ongoing trend for several years. High integration density demands electro-mechanical assembly in 3D. Essemtec will showcase a machine with the ability to stack components and subassemblies and join them with jetted solder paste or glue. This platform qmarhkql exdjhztw qzxefuv xmbbzruua mt dvjlka idaxway kvrov lerybmu, HGVF eltczec, bkcmrgtaw tkbdhputvi ifx essu- jthqcbq wszm dvcjp zydzapeoyn.
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