The ultimate performance boost consolidated edge applications have been waiting for

congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket

(PresseBox) (Deggendorf/Nuremberg, Germany, 17.03.2023)

congatec – a leading vendor of embedded and edge computing technology – announces the availability of new COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors. The launch expands the already available portfolio of high-performance COM-HPC modules with soldered processors to include the even more powerful socketed variants of this processor generation. The new conga-HPC/cRLS Computer-on-Modules in COM-HPC Size C form factor (120x160mm) address application areas that require especially outstanding multi-core and multi-thread performance, large caches, and enormous memory capacities combined with high bandwidth and advanced I/O technology. Target markets are performance-hungry industrial, medical,

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The ultimate performance boost consolidated edge applications have been waiting for

congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket

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