Advantest to Showcase EB Lithography and MVM-SEM® Solutions at the 41st Micro and Nano Engineering (MNE) Show in The Hague, Netherlands on 21-24 September

(PresseBox) ( Munich, )
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) will feature its portfolio of EB (electron beam) lithography and MVM-SEM® (Multi-Vision Metrology Scanning Electron Microscope) solutions in stand 17a at the 41st Micro and Nano Engineering Show, taking place 21-24 September at the World Forum in The Hague, Netherlands.

Highlighted products include the F7000 EB lithography system for direct writing of nano-patterns on wafers, the E3310 and E3640 MVM-SEM systems for wafer and mask metrology and the E5610 DR (defect review)-SEM for inspecting next-generation photomasks.

The F7000 EB lithography system delivers high throughput and can create nano-patterns on wafers with 1X-nm resolution. Direct-write technology is suitable as a design tool for research and development as well as on system LSI production lines, where small-lot-multiple-type devices are produced.

The E3310 and E3640 MVM-SEM systems enable real-time, 3D measurement and imaging. For tri-gate processing, the E3310 MVM SEM offers high efficiency for volume production. The E3640 system delivers the industry’s best pattern-measurement capability and high throughput for applications including standard photomasks, EUV photomasks and NIL templates.

The E5610 DR-SEM is designed for reviewing and classifying ultra-small defects in next-generation photomasks and blanks. The system offers highly stable, fully automatic image capturing with the long-term operational stability and reliability essential for manufacturing analyses of critical masks.

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MVM-SEM is either a registered trademark or a trademark of Advantest Corporation in Japan, the United States and other countries.
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