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New COM-Express Mini Module Targets
, Hardware, ADVANTECH Europe B.V
Advantech announces the arrival of SOM-7565-a COM-Express Mini module which provides a highly anticipated solution for small form-factor/low power consumption applications....
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New COM-Express Mini Module Targets
, Hardware, ADVANTECH Europe B.V
Advantech, the leading embedded platform and integration services provider, announces the arrival of SOM-7565-a COM-Express Mini module which provides a highly anticipated...
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Full-Graphic Displays for Difficult Lighting Conditions
, Hardware, Electronic Assembly GmbH
Electronic Assembly has developed the EA DIP122-5 line of displays with LED background illumination for extreme lighting conditions. The line covers indoor and outdoor...
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How to avoid High Frequency Effects on Debug Interfaces?
Today iSYSTEM AG presented the new "Trace Port PCB Design Guidelines" document that discusses design considerations for Printed Circuit Boards (PCBs) to prevent...
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Goodbye to Bond Wires! New packaging technology replaces wire bonding
, Elektrotechnik, SEMIKRON International GmbH
Semikron has developed a revolutionary packaging technology for power semiconductors which does away with bond wires, solders and thermal paste. The new SKiN Technology...
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Glass-film and glass-glass solar modules in various dimensions, formats and colors
, Energie- / Umwelttechnik, ACI-ecotec GmbH & Co. KG
To move away from purely standard module production towards manufacturing order-related crystalline high-performance photovoltaic modules to account for individual...
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Inexpensive, Aligned Laser Modules in Miniature
, Optische Technologien, LASER COMPONENTS GmbH
The small LC-LMD-650-12 laser modules are coaxially aligned models that are available as part of our LMD low-cost laser module series. While the housing and the...
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ADLINK Technology Announces Extreme Rugged(TM) ETX(TM) Module Based on the Intel® Atom(TM) Processor
, Hardware, ADLINK TECHNOLOGY EUROPEAN
ADLINK Technology, Inc., a leading global provider of ruggedized embedded products, announces the Ampro by ADLINK(TM) ETX-PVR, its latest Extreme Rugged(TM) ETX...
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465 pages of power semiconductor knowledge
, Elektrotechnik, SEMIKRON International GmbH
Semikron presents the German version of its Application Manual straight from the printing press - just in time for the fair SPS / IPC / Drives. The 465-page-long...
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Half the size of conventional 1200 V IPM's
, Elektrotechnik, SEMIKRON International GmbH
The MiniSKiiP IPM from SEMIKRON sets a new benchmark for power density in 1200V Intelligent Power Modules. At a weight of 55g and a volume of 49cm³, this module...
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Micronas current transducer family with digital output for automotive and industrial applications
Micronas (SIX Swiss Exchange: MASN), a leading supplier of innovative application-specific sensor and IC system solutions for automotive and industrial applications,...
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ADLINK Technology Debuts 6U CompactPCI® Processor Blade with Intel® Core(TM) i7 and QM57 Chipset, Supporting Optional Extended Temperature Range
, Hardware, ADLINK TECHNOLOGY EUROPEAN
The highlyintegrated cPCI-6510 Series incorporates two PMC sites and DDR3 memory with ECC. It is wellsuited for Military, Transportation, Aviation and Communications...
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COHERENT at the LASYS 2010
, Optische Technologien, Coherent GmbH
From 08th to 10th of June, the international materials processing branch meets at the LASYS 2010 in Stuttgart, Germany. COHERENT presents laser sources and processing...
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Single in-line AC and DC Output Pluggable Solid State Relays
Texim Europe recently introduced Crydoms new line of pluggable/solderable single in-line Solid State Relays, DIN rail mounted sockets and ready to use SSR/Socket...
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Preview for the print media for Seica SpA for SMT Nuremberg, Booth 249, Hall 7
, Produktionstechnik, Seica Deutschland
Seica SpA, a leading supplier in test and production solutions, will be featuring their latest advanced and emerging technologies in printed board design and manufacturing,...
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