AON1605 and AON1606 are housed in a tiny DFN1.0x0.6 package, while AON1611, AON1620, and AON1634 are offered in an ultra-small DFN1.6x1.6mm package. The ultra low on-resistance of these devices reduces conduction losses, translating into lower power consumption and longer battery life, which is essential in wireless applications. The compact footprint and ultra-thin (0.55mm) profile of both DFN1.6x1.6 and DFN1.0x0.6 power packages enables more efficient solutions in space-constrained applications.
"These new tiny DFN power packages utilize AlphaMOS(TM) technology, which enables exceptional performance and makes it possible for affordable form factor solutions for the wireless mobile market." said Peter Wilson, Director of Low Voltage MOSFETs at AOS.