This chip is based on the VPC3+CLF which is available since 2003. In addition to its established features (DP-V0/V1/V2 functions, 4 kB RAM memory), this device also offers a serial interface for SPI or I2C communication.
The exceptional feature of this device is the new package design. Thanks to its Low Power and 3,3V power supply requirements this package allows an ASIC design with smaller structures. The VPC3+S - packed in a BGA package with an edge length of 6x8mm - is advertised as "world wide smallest PROFIBUS ASIC".
Due to limited space on the circuit board, target applications are e.g. encoder products or sensors. Applications using VPC3+CLF or SPC3 can continue to use the parallel interface and existing firmware.
An extended version of the introduced software stack is available to provide a user friendly use of new functions, e.g. hardware PLL for DP-V2 IsoM. Also offered are software versions for the support of redundant slave applications with one or two micro controllers. The first examples will be available as of the 2nd quarter of 2009, serial delivery starting from mid of 2009.
The exceptional feature of this device is the new package design. Thanks to its Low Power and 3,3V power supply requirements this package allows an ASIC design with smaller structures. The VPC3+S - packed in a BGA package with an edge length of 6x8mm - is advertised as "world wide smallest PROFIBUS ASIC".
Due to limited space on the circuit board, target applications are e.g. encoder products or sensors. Applications using VPC3+CLF or SPC3 can continue to use the parallel interface and existing firmware.
An extended version of the introduced software stack is available to provide a user friendly use of new functions, e.g. hardware PLL for DP-V2 IsoM. Also offered are software versions for the support of redundant slave applications with one or two micro controllers. The first examples will be available as of the 2nd quarter of 2009, serial delivery starting from mid of 2009.
