Thermally conductive mounting of power devices, e.g. LEDs, on respective heat sinks can be substantially enhanced by using Polytec’s TC 433 boron nitride filled adhesive featuring 2 W/mK thermal conductivity and a glass transition around 110 °C after thermal curing, and withstanding up to 220 °C continuous operation temperature. TC 432 is a modification curing at room temperature with a pot life of ca. 15 min, about 1.8 W/mK thermal conductivity and ca. 75 – 80 °C glass transition temperature.
New Adhesives for Thermal Challenges in Microelectronics Assemby
Polytec TC 433 and TC 432
(PresseBox)
(Waldbronn, )
