Ultra-thin low-voltage MOSFETs in SOT-23F package
Ideally suited for use in portable devices and DC/DC converters
A further reduction of the package height was made possible by employing a flat lead structure, whereby the solder contacts protrude flat from the package. Thanks to the flat lead structure, the package can accommodate larger chips. As a result, this enables a reduction of on-resistance by up to 20 percent compared to MOSFETs in SOT23 package. The new MOSFETS are thereby capable of achieving up to 4.5 A (N0301N) of current.
Data sheets and samples of the four new devices - three P-channel MOSFETs and one N-channel MOSFET - are available now. Mass production is scheduled to begin in June 2009.
About Gleichmann & Co. Electronics GmbH
Founded in 1979, Gleichmann & Co. Electronics GmbH, in the same company group with MSC Vertriebs GmbH, has established itself as one of the leading pan-European distributors of electronic assemblies and components. One of the reasons for the high acceptance by customers and suppliers is the company's early focus on comparatively few, highly sophisticated products such as microcontrollers, programmable logic devices, displays and customer specific power supplies. From this, the resulting in-depth technical know-how of our sales engineers and field application engineers today enables us, if required by the customer, even implementation of complete new designs right up to the finished product. With two of its own ASIC design centers, the Gleichmann research laboratory in Austria and one of the largest and most modern programming centers in Europe, Gleichmann Electronics takes a leading role in terms of service and customer support. More information can be found at: www.msc-ge.com