.
- High-precision mounting of sensors and modules at new production facility
- Variable adhesives application
- Different wafer types and maximum-precision mounting on various substrates
AEMtec GmbH, a member company of exceet Group and a specialist for maximum-quality miniaturized technologies, will be presenting its brand-new cleanroom manufacturing capabilities at this year's SMT Hybrid.
AEMtec has recently expanded its manufacturing capacities and will take advantage of the trade fair in Nuremberg from May 5 to 7 to show how it uses them to create products such as modules for optical data transmission or sensors and camera modules - all in extraordinary quality, e.g. for medical products.
Ultramodern Technologies for Current Market Demands & Trends
In expanding its cleanroom production capacity, AEMtec relies on a machine by AMICRA. It features a range of cutting-edge technical solutions, e.g. different options for applying and hardening adhesives. This allows AEMtec to respond optimally to current client and market requirements and places the company in an ideal position to address upcoming technology trends.
Further highlights of AEMtec's expanded production capabilities include processing of different wafer types up to 300 mm in diameter and placement on substrates with a maximum surface of 600 x 550 mm². With placement precision of +/- 2.5µm @ 3sigma, the company can produce modules for optical data transmission as well as sensors and camera modules. AEMtec has also implemented connectivity with a fully automated handling system - a must for high-volume production.
Sensors: High Production Volumes, Attractively Priced
AEMtec has already been active in this segment since 2008 and provides deep competency and wide-ranging manufacturing capabilities in the field of high-precision mounting. The expanded production capacity at the Berlin facility now enables AEMtec to offer high production volumes at attractive prices.
Experience exceet / AEMtec at the SMT Hybrid packaging in Nuremberg from May 5 to 7 at the Fraunhofer IZM Booth accompanying the motto "Optics meets Electronics" Booth 6 - 109 c Matthias Lorenz, member of the SMT Hybrid Packaging congress committee, will give a lecture about high precision mounting for optical components.
About AEMtec
Headquartered at the renowned science and technology location Berlin Adlershof and operating manufacturing facilities there, AEMtec has special expertise in high-quality, miniaturized technologies for complex customized (opto-) electronic applications. The company uses a wide range of high-end chip-level technologies such as chip on board, flip chip, 3D integration and opto-packaging. Extensive development services in the field of feasibility studies on structural and connecting technologies, design and layout, as well as test equipment preparation to the transfer into series production round off its range of services.
- High-precision mounting of sensors and modules at new production facility
- Variable adhesives application
- Different wafer types and maximum-precision mounting on various substrates
AEMtec GmbH, a member company of exceet Group and a specialist for maximum-quality miniaturized technologies, will be presenting its brand-new cleanroom manufacturing capabilities at this year's SMT Hybrid.
AEMtec has recently expanded its manufacturing capacities and will take advantage of the trade fair in Nuremberg from May 5 to 7 to show how it uses them to create products such as modules for optical data transmission or sensors and camera modules - all in extraordinary quality, e.g. for medical products.
Ultramodern Technologies for Current Market Demands & Trends
In expanding its cleanroom production capacity, AEMtec relies on a machine by AMICRA. It features a range of cutting-edge technical solutions, e.g. different options for applying and hardening adhesives. This allows AEMtec to respond optimally to current client and market requirements and places the company in an ideal position to address upcoming technology trends.
Further highlights of AEMtec's expanded production capabilities include processing of different wafer types up to 300 mm in diameter and placement on substrates with a maximum surface of 600 x 550 mm². With placement precision of +/- 2.5µm @ 3sigma, the company can produce modules for optical data transmission as well as sensors and camera modules. AEMtec has also implemented connectivity with a fully automated handling system - a must for high-volume production.
Sensors: High Production Volumes, Attractively Priced
AEMtec has already been active in this segment since 2008 and provides deep competency and wide-ranging manufacturing capabilities in the field of high-precision mounting. The expanded production capacity at the Berlin facility now enables AEMtec to offer high production volumes at attractive prices.
Experience exceet / AEMtec at the SMT Hybrid packaging in Nuremberg from May 5 to 7 at the Fraunhofer IZM Booth accompanying the motto "Optics meets Electronics" Booth 6 - 109 c Matthias Lorenz, member of the SMT Hybrid Packaging congress committee, will give a lecture about high precision mounting for optical components.
About AEMtec
Headquartered at the renowned science and technology location Berlin Adlershof and operating manufacturing facilities there, AEMtec has special expertise in high-quality, miniaturized technologies for complex customized (opto-) electronic applications. The company uses a wide range of high-end chip-level technologies such as chip on board, flip chip, 3D integration and opto-packaging. Extensive development services in the field of feasibility studies on structural and connecting technologies, design and layout, as well as test equipment preparation to the transfer into series production round off its range of services.
