In addition to the MPC 8572E dual-core processor, XPedite5330 provides a PMC/XMC site along with Gigabit Ethernet and the traditional PCI bus. To provide a system designer with multiple hardware options, XPedite5330 is available in a full range of convection- or conduction-cooled configurations.
Features:
Freescale MPC8572E PowerQUICC™ III processor with dual e500 Power Architecture® cores at up to 1.5 GHz
Two separate DDR2-800 ECC SDRAM channels with up to 2 GB per channel
Up to 4 GB of NAND flash and 256 MB of redundant NOR flash
32-bit/33-MHz PCI
Two Gigabit Ethernet ports
Software Support:
Wind River VxWorks Board Support Package (BSP)
QNX Neutrino BSP
Green Hills INTEGRITY BSP
Linux LSP
Expert Comments:
“XPedite5330 is a continuation of Extreme Engineering's (X-ES) dedication to a modular product assembly line, allowing Extreme to move from one form factor to another with virtually identical hardware and software. Freescale's advanced MPC8572E dual-core processor is a natural fit to expand our 3U CompactPCI product offerings to our customers in a low-power/high-performance form factor,” states Aaron Lindner, Engineering Manager for X-ES.
“Extreme Engineering’s third MPC8572E product development in as many months underscores the company’s expertise in deploying Freescale silicon into compelling designs,” states Glenn Beck, a marketing manager within Freescale’s Networking Systems Division. “Offering customers multiple hardware configurations plus direct RTOS support helps our joint customers get to market fast.”
More Information:
XPedite5330 Data Sheet: http://www.etools.de/...
Features:
Freescale MPC8572E PowerQUICC™ III processor with dual e500 Power Architecture® cores at up to 1.5 GHz
Two separate DDR2-800 ECC SDRAM channels with up to 2 GB per channel
Up to 4 GB of NAND flash and 256 MB of redundant NOR flash
32-bit/33-MHz PCI
Two Gigabit Ethernet ports
Software Support:
Wind River VxWorks Board Support Package (BSP)
QNX Neutrino BSP
Green Hills INTEGRITY BSP
Linux LSP
Expert Comments:
“XPedite5330 is a continuation of Extreme Engineering's (X-ES) dedication to a modular product assembly line, allowing Extreme to move from one form factor to another with virtually identical hardware and software. Freescale's advanced MPC8572E dual-core processor is a natural fit to expand our 3U CompactPCI product offerings to our customers in a low-power/high-performance form factor,” states Aaron Lindner, Engineering Manager for X-ES.
“Extreme Engineering’s third MPC8572E product development in as many months underscores the company’s expertise in deploying Freescale silicon into compelling designs,” states Glenn Beck, a marketing manager within Freescale’s Networking Systems Division. “Offering customers multiple hardware configurations plus direct RTOS support helps our joint customers get to market fast.”
More Information:
XPedite5330 Data Sheet: http://www.etools.de/...
